APA (7th ed.) Citation

LAU, J. H. (2000). Low Cost Flip Chip Technologies: For DCA, WLCSP, and PBGA Assemblies. The McGraw-Hill Companies, Inc.

Chicago Style (17th ed.) Citation

LAU, John H. Low Cost Flip Chip Technologies: For DCA, WLCSP, and PBGA Assemblies. The McGraw-Hill Companies, Inc, 2000.

MLA (8th ed.) Citation

LAU, John H. Low Cost Flip Chip Technologies: For DCA, WLCSP, and PBGA Assemblies. The McGraw-Hill Companies, Inc, 2000.