Chip scale package
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McGraw-Hill
1999
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oai:lib.uajy.ac.id:00000361072004-10-06 00:00:00.000Chip scale packageLau, John HELCTRONICSMcGraw-Hill1999Referensixxii, 564 p. 24 cm621.3022 LAU cISBN:0-07-116508-8Asinghttps://siquest.uajy.ac.id/description/0000036107 |
institution |
Universitas Atma Jaya Yogyakarta |
collection |
Perpustakaan Yogyakarta |
language |
Asing |
topic |
ELCTRONICS |
spellingShingle |
ELCTRONICS Lau, John H Chip scale package |
description |
|
format |
Referensi |
author |
Lau, John H |
author_facet |
Lau, John H |
author_sort |
Lau, John H |
title |
Chip scale package |
title_short |
Chip scale package |
title_full |
Chip scale package |
title_fullStr |
Chip scale package |
title_full_unstemmed |
Chip scale package |
title_sort |
chip scale package |
physical |
xxii, 564 p. 24 cm |
publisher |
McGraw-Hill |
publishDate |
1999 |
callnumber-raw |
621.3022 LAU c |
callnumber-search |
621.3022 LAU c |
isbn |
ISBN:0-07-116508-8 |
_version_ |
1740829102745583616 |