Chip scale package

Guardado en:
Detalles Bibliográficos
Autor principal: Lau, John H
Formato: Referensi
Lenguaje:Asing
Publicado: McGraw-Hill 1999
Materias:
Etiquetas: Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
PINJAM
id oai:lib.uajy.ac.id:0000036107
record_format oai_dc
spelling oai:lib.uajy.ac.id:00000361072004-10-06 00:00:00.000Chip scale packageLau, John HELCTRONICSMcGraw-Hill1999Referensixxii, 564 p. 24 cm621.3022 LAU cISBN:0-07-116508-8Asinghttps://siquest.uajy.ac.id/description/0000036107
institution Universitas Atma Jaya Yogyakarta
collection Perpustakaan Yogyakarta
language Asing
topic ELCTRONICS
spellingShingle ELCTRONICS
Lau, John H
Chip scale package
description
format Referensi
author Lau, John H
author_facet Lau, John H
author_sort Lau, John H
title Chip scale package
title_short Chip scale package
title_full Chip scale package
title_fullStr Chip scale package
title_full_unstemmed Chip scale package
title_sort chip scale package
physical xxii, 564 p. 24 cm
publisher McGraw-Hill
publishDate 1999
callnumber-raw 621.3022 LAU c
callnumber-search 621.3022 LAU c
isbn ISBN:0-07-116508-8
_version_ 1740829102745583616