Chip scale package
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| Main Author: | |
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| Format: | Referensi |
| Language: | Asing |
| Published: |
McGraw-Hill
1999
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| Subjects: | |
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oai:lib.uajy.ac.id:0000036107 |
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oai:lib.uajy.ac.id:00000361072004-10-06 00:00:00.000Chip scale packageLau, John HELCTRONICSMcGraw-Hill1999Referensixxii, 564 p. 24 cm621.3022 LAU cISBN:0-07-116508-8Asinghttps://siquest.uajy.ac.id/description/0000036107 |
| institution |
Universitas Atma Jaya Yogyakarta |
| collection |
Perpustakaan Yogyakarta |
| language |
Asing |
| topic |
ELCTRONICS |
| spellingShingle |
ELCTRONICS Lau, John H Chip scale package |
| description |
|
| format |
Referensi |
| author |
Lau, John H |
| author_facet |
Lau, John H |
| author_sort |
Lau, John H |
| title |
Chip scale package |
| title_short |
Chip scale package |
| title_full |
Chip scale package |
| title_fullStr |
Chip scale package |
| title_full_unstemmed |
Chip scale package |
| title_sort |
chip scale package |
| physical |
xxii, 564 p. 24 cm |
| publisher |
McGraw-Hill |
| publishDate |
1999 |
| callnumber-raw |
621.3022 LAU c |
| callnumber-search |
621.3022 LAU c |
| isbn |
ISBN:0-07-116508-8 |
| _version_ |
1740829102745583616 |