Chip scale package

समान संसाधन

• ABSTRACTION FOR PROGRAMMERS
  द्वारा: J.A ZIMMER
  प्रकाशित: ()
• Introduction to Power Elctronics
  द्वारा: Hart, Daniel W.
  प्रकाशित: (1997)
• Electronic assembly fabrication: Chips, Circuit boards, Packages, and Components
  द्वारा: Charles A. Harper
  प्रकाशित: (2002)
• Low Cost Flip Chip Technologies : for DCA, WLCSP, and PBGA Assemblies
  द्वारा: LAU, John H.
  प्रकाशित: (2000)
• Low Cost Flip Chip Technologies : for DCA, WLCSP, and PBGA Assemblies
  द्वारा: LAU, John H.
  प्रकाशित: (2000)