Semiconductor Packaging and Case Outlines
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| Main Author: | |
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| Format: | TEXT |
| Language: | Ing |
| Published: |
American Seal & Packing
2000
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| Subjects: | |
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| id |
sman1ylib-4540 |
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sman1ylib-45402016-08-08 00:00:00Perpustakaan SMAN 1 YogyakartaSemiconductor Packaging and Case OutlinesLonne MaysSemiconductor Packaging and Case OutlinesAmerican Seal & Packing2000TEXT23;176;000/003.3/MAY/S/j.1ISBN:--Ing |
| institution |
SMAN 1 Yogyakarta |
| collection |
Perpustakaan Yogyakarta |
| language |
Ing |
| topic |
Semiconductor Packaging and Case Outlines |
| spellingShingle |
Semiconductor Packaging and Case Outlines Lonne Mays Semiconductor Packaging and Case Outlines |
| description |
|
| format |
TEXT |
| author |
Lonne Mays |
| author_facet |
Lonne Mays |
| author_sort |
Lonne Mays |
| title |
Semiconductor Packaging and Case Outlines |
| title_short |
Semiconductor Packaging and Case Outlines |
| title_full |
Semiconductor Packaging and Case Outlines |
| title_fullStr |
Semiconductor Packaging and Case Outlines |
| title_full_unstemmed |
Semiconductor Packaging and Case Outlines |
| title_sort |
semiconductor packaging and case outlines |
| physical |
23;176; |
| publisher |
American Seal & Packing |
| publishDate |
2000 |
| callnumber-raw |
000/003.3/MAY/S/j.1 |
| callnumber-search |
000/003.3/MAY/S/j.1 |
| isbn |
ISBN:-- |
| _version_ |
1742478625243922432 |