Low Cost Flip Chip Technologies : for DCA, WLCSP, and PBGA Assemblies
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The McGraw-Hill Companies, Inc.
2000
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uiilib-520BKE0031222016-08-08 00:00:00Direktorat Perpustakaan Universitas Islam IndonesiaLow Cost Flip Chip Technologies : for DCA, WLCSP, and PBGA AssembliesLAU, John H. The McGraw-Hill Companies, Inc.2000TEXT621.381 / Joh / t |
| institution |
Universitas Islam Indonesia |
| collection |
Perpustakaan Universitas Islam Indonesia |
| description |
|
| format |
TEXT |
| author |
LAU, John H. |
| spellingShingle |
LAU, John H. Low Cost Flip Chip Technologies : for DCA, WLCSP, and PBGA Assemblies |
| author_facet |
LAU, John H. |
| author_sort |
LAU, John H. |
| title |
Low Cost Flip Chip Technologies : for DCA, WLCSP, and PBGA Assemblies |
| title_short |
Low Cost Flip Chip Technologies : for DCA, WLCSP, and PBGA Assemblies |
| title_full |
Low Cost Flip Chip Technologies : for DCA, WLCSP, and PBGA Assemblies |
| title_fullStr |
Low Cost Flip Chip Technologies : for DCA, WLCSP, and PBGA Assemblies |
| title_full_unstemmed |
Low Cost Flip Chip Technologies : for DCA, WLCSP, and PBGA Assemblies |
| title_sort |
low cost flip chip technologies : for dca, wlcsp, and pbga assemblies |
| publisher |
The McGraw-Hill Companies, Inc. |
| publishDate |
2000 |
| callnumber-raw |
621.381 / Joh / t |
| callnumber-search |
621.381 / Joh / t |
| _version_ |
1747212993230274560 |