Electronic assembly fabrication: Chips, Circuit boards, Packages, and Components
ir,c.1
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Main Author: | |
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Format: | Sirkulasi |
Language: | Inggris |
Published: |
Mc .Grow-Hill
2002
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Summary: | ir,c.1 |
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Physical Description: | xv, 672; 21 |
ISBN: | ISBN:0-07-137882-0 |