Electronic assembly fabrication: Chips, Circuit boards, Packages, and Components

ir,c.1

Saved in:
Bibliographic Details
Main Author: Charles A. Harper
Format: Sirkulasi
Language:Inggris
Published: Mc .Grow-Hill 2002
Subjects:
Tags: Add Tag
No Tags, Be the first to tag this record!
PINJAM
id uinsukalib-044811
record_format oai_dc
spelling uinsukalib-0448112007-04-06Electronic assembly fabrication: Chips, Circuit boards, Packages, and ComponentsCharles A. HarperELEKTRONIK - ALATir,c.1Mc .Grow-Hill2002Sirkulasixv, 672; 21ir, .01ISBN:0-07-137882-0Inggris
institution Universitas Islam Negeri Sunan Kalijaga
collection Perpustakaan Yogyakarta
language Inggris
topic ELEKTRONIK - ALAT
spellingShingle ELEKTRONIK - ALAT
Charles A. Harper
Electronic assembly fabrication: Chips, Circuit boards, Packages, and Components
description ir,c.1
format Sirkulasi
author Charles A. Harper
author_facet Charles A. Harper
author_sort Charles A. Harper
title Electronic assembly fabrication: Chips, Circuit boards, Packages, and Components
title_short Electronic assembly fabrication: Chips, Circuit boards, Packages, and Components
title_full Electronic assembly fabrication: Chips, Circuit boards, Packages, and Components
title_fullStr Electronic assembly fabrication: Chips, Circuit boards, Packages, and Components
title_full_unstemmed Electronic assembly fabrication: Chips, Circuit boards, Packages, and Components
title_sort electronic assembly fabrication: chips, circuit boards, packages, and components
physical xv, 672; 21
publisher Mc .Grow-Hill
publishDate 2002
callnumber-raw ir, .01
callnumber-search ir, .01
isbn ISBN:0-07-137882-0
_version_ 1741222848687505408